Wacker hedrar forskare som utvecklat en ny process för tillverkning av ultraplatta kiselskivor
Om översättning önskas till svenska, kontakta marie-louise.kaervedal@wacker.com Munich and Burghausen, July 9, 2010 – Wacker Chemie AG bestowed its annual Alexander Wacker Innovation Award on Dr. Georg Pietsch and Michael Kerstan yesterday for the devel-opment of a novel grinding process for semiconductor wafers. Their innovation will allow ultra-flat silicon wafers to be manu-factured for future generations of electronic components. Called Planetary Pad Grinding (PPG), the process combines the advan-tages of two techniques previously considered incompatible – lapping and grinding.