Maailman johtavat rakenteellisen elektroniikan toimijat kokoontuvat Ouluun IMSE-teknologiakonferenssiin jo toistamiseen

TactoTek conference features experts in design, materials, production and testing in automotive, industrial, smart home and consumer markets. 

OULU, FINLAND (15 May 2019) – TactoTek, the global leader in injection molded structural electronics (IMSE™) technology, with support from Platinum sponsor MacDermid Performance Solutions, Silver sponsors, Altium and Niebling, and presenters from across the in-mold electronics ecosystem will convene the IMSE Days 2.0 conference on June 5, 2019 in Oulu, Finland. Printed electronics are at the core of IMSE solutions, and Oulu is the center of a region globally known for printed electronics innovation, and home to leaders in printed electronics research, development and industrialization. 

“Demand for IMSE solutions, single piece seamless parts that integrate electronic functions including touch controls, lighting and wireless communications, within 3D injection molded structures, is growing quickly across markets, including automotive, industrial, smart home and consumer use cases,” said Dave Rice, SVP Marketing at TactoTek, “this event is designed to accelerate learning by sharing knowledge across the ecosystem and building relationships that are the foundation of successful projects.”

Conference participants span the IMSE ecosystem, including OEMs/brands and their suppliers, and representatives of the design systems, materials, equipment and testing solutions that support to successfully IMSE design and mass production. 

Announced speakers at IMSE Days 2.0 include Faurecia, Novem, Bö-La, OSRAM, Cypress Semiconductor, MacDermid, Covestro, OptoFidelity, TactoTek, and will include presentations and live demonstrations of printed electronics and mechanics computer-aided design (CAD) from Altium and Dassault Systémes. In addition to presentations, leaders in printed electronics materials will be available to share their knowledge during the event. 

“In this conference, market leaders report on their experiences with IMSE technology, and experts in IMSE design, production and testing share their insights. It’s a very efficient way to advance your knowledge about in-mold electronics in general and IMSE in specific, and learn what it takes to succeed,” noted Sini Rytky, VP Product Management for TactoTek.

To learn more about IMSE Days 2.0 and register online, visit: https://tactotek.com/imse_days_20/

Heini Tuorila, markkinointijohtaja, heini.tuorila@tactotek.com, +358 40 7096512

Jussi Harvela, toimitusjohtaja, jussi.harvela@tactotek.com,+358 40 5005445

TactoTek kehittää maailmanlaajuisesti ainutlaatuista rakenteellista elektroniikkaa, joka mahdollistaa painetun elektroniikan ja eri komponenttien integroimisen ruiskuvaletun kolmiulotteisen muovirakenteen sisään. Yritys tarjoaa työkalut ja osaamisen uudenlaisen elektroniikan tuotantovalmiiden prototyyppien suunnitteluun sekä skaalautuvaan massatuotantoon muun muassa auto- ja kodinkoneteollisuuden sekä puettavan elektroniikan tarpeisiin. TactoTekin rahoittajia ovat suomalainen pääomasijoitusyhtiö Conor Venture Partners, Ascend Capital Partners, Faurecia Ventures, Plastic Omnium, Nanogate, Leaguer VC, VTT Ventures, Business Finland, EU:n Horizon 2020 -ohjelma sekä yksityiset enkelisijoittajat. Lisätietoja www.tactotek.com.