MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on July 30th, 2021 by the China National Intellectual Property Administration (CNIPA). This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing. This design significantly improves throughput when multiple tools are needed in fabricating complex multi-die devices by practically eliminating time consuming tool changeovers.

This patent is among the first of many patents being applied for in China and around the globe. We expect more patents to be granted following this success. Our effort in rigorously seeking patent protection in China reflects our confidence in the Chinese market potential for our die bonder systems, as well as in the increasing effectiveness of intellectual property protection in China. Innovation is key to our ability to support our customers. Mycronic is committed to technological innovations and is determined to enforce protection of our intellectual property worldwide.

For additional information, please contact:
Cyriac Devasia

CTO Global Technologies
Tel: +1 (978) 495-9741, e-mail:
Time Zone: ET – Eastern Time

Jennifer Russo

Marketing Manager, MRSI Systems (Mycronic Group)
Tel: +1 (978) 495-9731, e-mail:
Time Zone: ET – Eastern Time


About MRSI Systems  

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit    

About Mycronic   

Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm.