Micronic Mydata's rights issue fully subscribed

Täby, Sweden, May 27, 2010 - Micronic Mydata AB (listed on NASDAQ OMX
Stockholm, in the category Small Cap, Information Technology: MICR) today
announces that the rights issue has been fully subscribed.

Micronic Mydata's new share issue with preferential rights for shareholders has
now been completed. The new share issue, in which more than 99 percent were
subscribed for with preferential right by the shareholders, generated
approximately SEK 232 million after transaction costs. Remaining shares will be
allocated by the Board of Directors.

”We are very pleased with the strong support from the shareholders in Micronic
Mydata. The capital generated in the new share issue will secure financing of
development and marketing of the company's laser based LDI system aimed for the
electronic packaging market, a market estimated to account for a substantial
part of the company's future growth”, says Peter Uddfors, President and CEO of
Micronic Mydata AB.

The new shares are expected to become available for trading on the NASDAQ OMX
Stockholm Exchange from around June 2, 2010.

The total number of shares amounts to 97,916,509 after the new share issue,
representing a share capital amounting to SEK 97,916,509.


Company contacts:                     
Peter Uddfors        
President & CEO
Tel: +46 8 638 52 00    
peter.uddfors@micronic-mydata.com        


Carl-Johan Blomberg
CFO
Tel: +46 8 638 52 00
carl-johan.blomberg@micronic-mydata.com


About Micronic Mydata AB
Micronic Mydata AB is a Swedish high-tech company engaged in the development,
manufacture and marketing of a series of extremely accurate laser pattern
generators for the production of photomasks and advanced surface mount
technology (SMT) equipment for flexible production of electronics. The pattern
generators are used by the world's leading electronics companies in the
manufacture of television and computer displays, semiconductor circuits and
semiconductor packaging components. The SMT equipment, including software
applications, is used for surface mounting of electronic components and stencil
free jetting of solder paste. Micronic Mydata headquarters is located
in Täby, north of Stockholm and at present the Group has subsidiaries in China,
France, Germany Japan, Singapore, South Korea, Taiwan, the Netherlands, United
Kingdom and the United States. For more information see our web site at: www.micronic-mydata.com

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