Diamorph refinances existing bonds by issuing a five year bond loan

Diamorph AB (publ) has decided to issue a senior, secured corporate bond of SEK 500 million within a framework amount of SEK 800 million on the Swedish market. The bond carries a fixed interest rate of 7.00 percent per year and matures in September 2019. The company intends to list the bonds on NASDAQ OMX Stockholm.

The proceeds will be used to refinance the company’s existing SEK 425 million bond and settle outstanding deferred liabilities from the acquisition of the Tenmat group of companies in 2012, which are accelerated by the refinancing.

The company will give notice to the holders of the company’s existing SEK 425,000,000 bonds 2012/2017 (with ISIN SE0004636512) that the company will exercise its option for early redemption of the existing bonds in full. The date on which the early redemption will occur will be 2 October 2014 and the record date for early redemption will be 25 September 2014. The bonds will be redeemed at 107.5 per cent of their nominal amount (i.e. SEK 1,075,000 per bond) plus accrued interest from the preceding interest payment date up to and including the early redemption date.

The existing bonds will be delisted from the corporate bond list at NASDAQ OMX Stockholm on or about 22 September 2014, which according to NASDAQ OMX Stockholm will also be the last day of trading in the bonds.

Carnegie Investment Bank and Pareto Securities acted as financial advisers to the company in the bond issue and Gernandt & Danielsson acted as legal adviser.

Stockholm, August 27, 2014

Diamorph AB (publ)
Fredrik Svedberg, CEO

For additional information, please contact:
Fredrik Svedberg, CEO
Telephone: +46 8 612 68 50

Mark Hutchison, CFO
Telephone +44 7930 118555

About Diamorph
Diamorph supplies advanced material solutions for especially demanding industrial applications. The company is headquartered in Stockholm and has units in England and Czech Republic. Diamorph’s vision is to become a globally leading niche supplier of advanced materials.


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