ETTEPLAN CONSIDERS ISSUANCE OF HYBRID BONDS
ETTEPLAN OYJ STOCK EXCHANGE RELEASE NOVEMBER 16, 2009 at 9.30 a.m.
ETTEPLAN CONSIDERS ISSUANCE OF HYBRID BONDS
Etteplan Oyj is considering the issuance of hybrid capital bonds. The potential
issue is expected to be launched in the near future subject to market
conditions. The targeted size of the issue is approximately EUR 10 million.
Sofia Bank is the sole bookrunner of the potential issue and Etteplan's
financial adviser in the arrangement.
Hybrid bond is a bond that is subordinated to the company's other debt
obligations and treated as equity in the IFRS financial statements. Hybrid
bonds do not confer to holders the right to vote at shareholder meetings and do
not dilute the holdings of the current shareholders.
Hollola, November 16, 2009
Etteplan Oyj
Group Communications
Additional information:
Matti Hyytiäinen, President and CEO, tel. +358 400 710 968
DISTRIBUTION:
NASDAQ OMX Helsinki
Major media
www.etteplan.com
Etteplan is a specialist in industrial equipment engineering and technical
product information solutions and services. Our customers are global leaders in
their fields and operate in areas like the automotive, aerospace and defence
industries as well as the electricity generation and power transmission sectors,
and material flow management.
Etteplan has comprehensive competence in electronics and embedded systems
development, automation and electrical design, mechanical design and technical
product information solutions and services.
Etteplan's strength lies in its highly skilled employees who, being located near
to the customers, are able to develop close, long term business relationships.
We implement solutions globally according to customer needs.
In 2008, Etteplan had turnover of EUR 135.3 million. The company currently has
approximately 1,700 employees. Etteplan's shares are listed on NASDAQ OMX
Helsinki Ltd under the ETT1V ticker.