AMETEK ECP Unveils New S-Bend Ceramic Feedthrough Design for High-Speed Transmission Applications at OFC 2015
Ildar Bekbay, Phone: +1 508-998-4395, Email: ildar.bekbay@ametek.com NEW BEDFORD, MA— AMETEK Electronic Components & Packaging unveiled its new S-Bend Ceramic Feedthrough design at this year’s Optical Fiber Communications (OFC) Conference in Los Angeles. The S-Bend Ceramic Feedthrough is a new high-speed transmission design for receiver and modulator applications. The patent-pending design incorporates a curved s-bend cross section, which provides a smooth uninterrupted RF signal path. This new design provides a high-frequency interconnect advantage by eliminating 90-degree