Asetek Announces Ongoing Collaboration with Intel on Liquid Cooling for Servers and Datacenters
March 15, 2018 – In anticipation of forthcoming product announcements, Asetek today announced an ongoing collaboration with Intel to provide hot water liquid cooling for servers and datacenters.
This collaboration, which includes Asetek’s ServerLSL and RackCDU D2C technologies, is focused on the liquid cooling of density-optimized Intel® Compute Modules supporting high-performance Intel® Xeon® Scalable processors.
“Asetek liquid cooling solutions are designed to support high-powered CPUs in an energy-efficient and cost-effective manner,” said Andre Eriksen, Asetek CEO and Founder.