Epec announces High-Performing Computing Unit (HPCU) development with Hiab as lead customer
Epec today announced the development of its upcoming High-Performing Computing Unit (HPCU), a central computing unit designed for demanding, real-time machine applications and advanced digital user experiences. Hiab will act as the lead customer for HPCU, with the solution planned to be integrated as the central computing unit for autonomous systems in Hiab’s MULTILIFT demountables product portfolio.
The collaborationrepresentsa design win forEpec’supcoming HPCU and supports its intended role as a central computing unit for autonomous and software-defined machine applications.
Designed to support modern software-defined architectures, HPCU is intended to enable OEMs toconsolidatefunctions and scale advanced features such as automationassistance(AA) and on-device AI, alongside responsive HMI and connected services, while meeting industrial requirements for robustness and lifecycle management.
HPCU is developed in collaboration with Qualcomm Technologies, Inc. and is based on Qualcomm Technologies’ Snapdragon Ride™ Platform. With Snapdragon Ride, the HPCU will be equipped to provide the compute performance, connectivity, and software scalabilityrequiredto support software-defined machines, advanced HMI concepts, and assistive functions at the edge.
Hiab design winvalidatesreal-world readiness
The design win with Hiab confirms the HPCU’s suitability for high-demand deployments where performance, safety and reliability, and long-term support in varying environments are critical. As the central computing unit for autonomous systems in Hiab MULTILIFTproducts, HPCU is intended to help manufacturers shorten development cycles and enable differentiated, software-driven user experiences.
“Hiab’s selection of our upcoming HPCU is a major milestone for Epec as we expand our high-performance computing portfolio,” says JyriKylä-Kaila, CEO of Epec. “With Hiab as our lead customer and design win, we’re developing a product that supports advanced control and compute workloads, enabling AA and AI capabilities while maintaining industrial-and automotive-grade reliability.”
“Hiab is focused on delivering smarter, more capable solutions to our customers,” says Hannu Hyttinen, Director, R&D, Hiab’sDemountablesandDefencedivision. “Epec’sHPCU provides the performance foundation we need for next-generation features and digital capabilities in our MULTILIFT products. This design win reflects strong alignment between our product ambitions andEpec’stechnology roadmap from heavy machinery to automotive excellence.”
“Epec’sHPCU represents an important expansion of high-performance central computing into new industrial, on-roadand off-road segments,” said Anshuman Saxena, VP and GM, ADAS & Robotics, Qualcomm Technologies, Inc. “By building on the Snapdragon Ride Platform, Epec is bringing automotive grade compute, connectivity, and AI capabilities to a new class of machines. Hiab’s selection of HPCU underscores the strong industry demand for scalable, software defined control systems, andwe’reexcited to support Epec as they help OEMs accelerate the shift toward smarter, safer, and more capable equipment.”
Powered by Snapdragon Ride
Built on Snapdragon Ride, the HPCU delivers the high-performance computing needed for advanced non-road machinery and road vehicles. It supports modern software stacks and compute-intensive workloads, enabling responsive digital cabins, intelligent assistivefunctionsand edge AI automation. The platform also aligns withEpec’score strengths in safety-critical, long-life cycle industrial systems, helping OEMs build smarter, moreefficientand more connected heavy machines that perform dependably in the field.
Availability
HPCU is an upcomingseriesproduct.Additionalproduct details, technical specifications, and production schedules will be communicated in future announcements. OEMs and partners interested in early discussions can contact Epec for further information. During CES 2026 in Las Vegas, Epec will host private meetings with invited guests to discuss the HPCU concept and share insights into its intended capabilities and use cases.
Media Contact
Epec Oy
Email: sales@epec.fi
Phone: +358 (0)20 760 8111
About Epec Oy
Epec Oy, founded in 1978, is a technology company specializing in advanced control systems, electrification solutions, and software tools for off-highway and commercial vehicle industries. With decades of experience and a global customer base, Epec supports manufacturers in developing intelligent, connected, and efficient machines.
Learn more: www.epec.fi
About Hiab
Hiab (Nasdaq Helsinki: HIAB) is a leading provider of smart and sustainable on road load-handling solutions, committed to delivering the best customer experience every day with the most engaged people and partners. Globally, Hiab is represented on every continent through its extensive network of 3,000 own and partner sales and service locations, enabling delivery to over 100 countries. The company's continuing operations sales in 2024 totalled approximately EUR 1.6 billion and it employs over 4,000 people. www.hiabgroup.com