Products compliant with the Bluetooth v1.2 specification offer features such as faster connection times, enhanced voice quality and adaptive frequency hopping, for improved coexistence with other wireless technologies. ST's new chip will be fully compliant with the new standard, backwards compatible with all v1.1 solutions and interoperable with all current Bluetooth solutions.

ST's new Bluetooth designs benefit from the advanced capabilities of the company's low power HCMOS9 (0.13 micron) technology, such as low leakage currents, translating to a superior battery life performance. The technology allows seamless integration of RF, power management and digital functionality into one silicon die.

"Integration to the v1.2 standard requires an upgrade of software and baseband along with detailed testing for interoperability standards," said Jacques Wenin, ST's Bluetooth Business Unit Director. "This is a serious technical challenge that requires a lot of resources and manufacturing know-how. We chose Ericsson due to their large base of experienced staff in Bluetooth wireless technology and the assurance that their Intellectual Property (IP) will be interoperable with other deployed solutions."

"STMicroelectronics is a key developer of technologies for the PC, access-point, and mobile marketplace," said Maria Khorsand, President of Ericsson Technology Licensing. "We are proud to be selected once again as ST's Bluetooth partner.  Our Bluetooth 1.2 platform will ensure ST a fast time to market for a single chip with full 1.2 capability. It strengthens our alliance and is an injection to the entire Bluetooth community, which needs major semiconductor vendors like ST to be fully committed to Bluetooth."

Read more at http://www.ericsson.com/press