Rehm CondensoX; an enabling technology for 3D and MID
As Molded Interconnect Device (MID) technology becomes increasing popular, Rehm Thermal Systems (www.rehm-group.com) condensation soldering technology offers a precise, high efficiency alternative to the intricate processes commonly employed to create the connections between assembled components and the substrate.
MID is the abbreviation for "Molded Interconnect Device." The goal of MID technology is to unite electrical and mechanical functions in a single construction unit. The circuit tracks are integrated into the housing, enabling the reduction of weight and space, and are more eco-friendly than conventional PCBs. While the technology is currently most popular in vehicle electronics and telecommunications, the number of these components available on the market is growing markedly. As a result, MIDs are increasingly being integrated into computers, household appliances and medical devices.
There are several steps in the manufacture of an MID assembly. The ready-made substrate is prepared for assembly by the application of conductive adhesive or solder paste. Assembly is performed by special assembly robots which can handle the parts flexibly.
Selective soldering systems have been commonly employed to create the connections between the assembled components and the substrate. As an alternative, thermoplastic which is resistant to high temperatures is used during the substrate production stage so that it can work at the higher temperatures experienced during reflow soldering.
A precise and highly efficient alternative to this intricate process is the use of vapor phase or condensation soldering. And the CondesoX condensation soldering system from Rehm introduces numerous technology advantages. The Condenso allows identical profiles to be transported at different height levels in just a few steps. The reason for this is the exchange of air in the soldering chamber with a homogeneously distributed Galden perfluoropolyether atmosphere using the variable CondensoX vacuum technology. The low boiling point of Galden can be used across the vapor pressure curve while higher quantities of heat are transferred at a lower temperature. Flexible handling systems and product carriers also ensure a smooth process cycle and efficient work flow.
Rehm Contact
Carmen Hilsenbeck
Rehm Thermal Systems GmbH
Leinenstrasse 7
D-89143 Blaubeuren-Seissen
Germany
Tel : 49 (7344) 9606-35
Email : c.hilsenbeck@rehm-group.com
Protean Marketing Contact - Debbie Gomez
Unit 1, Cutbush Court
Danehill, Lower Earley
Reading,
RG6 4UW, UK
Tel: 44 1189 759880
Email: debbie@protean.co.uk
About Rehm Thermal Systems
Rehm Thermal Systems (www.rehm-group.com) is an international supplier to the electronics and photovoltaic industries, specializing in convection, condensation and selective soldering, as well as curing and firing technologies. Rehm has manufacturing operations in Germany, China, and Russia, and technical support facilities throughout Europe, Asia and North America.
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