MRSI to offer die bonding demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting at Productronica. Product demos will be offered at the Mycronic Booth #342 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 16-19th, 2021.
MRSI will demonstrate the industry-leading 1.5 micron die bonder, MRSI-H-HPLD which will highlight
- tailored design for bonding large high-power laser diodes in mass production
- capability of die bonding single emitter, bar laser in different packages, like CoS, C-mount, Bar-on-Submount(BoS), etc.
- proprietary self-leveling tool for co-planarity bonding.
The system is optimized for applications that bond large die for high-power laser diodes used in industrial lasers, optical fiber amplifiers, power amplifiers, lighting, and sensors. This versatile assembly solution enables our customers to scale their business by delivering high throughput, high reliability, and high flexibility.
Contact sales.mrsi@mycronic.com to schedule a meeting. Click here to learn more and receive a free visitor ticket.
For additional information, please contact:
Dr. Yi Qian
Mycronic Group VP & MRSI Systems General Manager
Tel: +1 (978) 667 9449, e-mail: yi.qian@mycronic.com
Time Zone: ET – Eastern Time
Jennifer Russo
Marketing Manager, MRSI Systems (Mycronic Group)
Tel: +1 (978) 495 9731, e-mail: jennifer.russo@mycronic.com
Time Zone: ET – Eastern Time
About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com