MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019.
MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by Infostone Communication Consultant (ICCSZ) in Shenzhen, China, from September 2-3, 2019. Dr. Yi Qian, Vice President of Marketing, MRSI Systems, will be presenting “Progress in Assembly Automations: Volume Manufacturing of Photonics Devices in Data Center and 5G Era.”
At CIOE’17, MRSI introduced the most flexible, high-speed, high-precision die bonder H-series product line. This series is driven by 40/100/200/400/800G technology evolutions, data centers, and 5G wireless applications. Since then, MRSI has successfully installed dozens of these systems worldwide. MRSI has also announced improved accuracy of ±1.5 micrometers at 3 sigma, for the most current product line under their new names: MRSI-HVM and MRSI-H. For more on these changes, view the recent August press release.
Dr. Qian states: “MRSI uses a ‘One Stop Shop’ strategy. R&D, pilot, and volume production are all based on the same hardware and software platforms. The approach reduces the risks associated with equipment changes during New Product Introduction and volume ramping. This year we have completed the H/HVM-series product line, which covers all key applications. Our customers are guaranteed to achieve high-mix high-volume photonics manufacturing with high ROI.”
“Our progress further demonstrates MRSI’s commitment to providing application targeted solutions in response to the requirements of our customers,” concluded Mr. Michael Chalsen, President of MRSI Systems.
Product demonstrations and customer part prototyping are currently held at the new Mycronic facility in the Nanshan District of Shenzhen, China. MRSI has on-site application engineers equipped with the most current process knowledge in the industry. Find out what the demo center has to offer and schedule an appointment with the sales team at email@example.com.
For additional information, please contact:
Dr. Yi Qian
Vice President of Marketing, MRSI Systems
Tel: +1 (978) 667-9449, e-mail: firstname.lastname@example.org
Time Zone: EST – Eastern Standard Time
About MRSI Systems
MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com
Mycronic AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Singapore, South Korea, the Netherlands, United Kingdom and the United States. Mycronic AB (publ) is listed on NASDAQ Stockholm. www.mycronic.com