MRSI to present at Automotive LIDAR 2021

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MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the industry exclusively focused on automotive LIDAR technologies and applications.

On Thursday September 23rd , Dr. Limin Zhou, MRSI’s Senior Director of Strategic Marketing, will present “Die Bonding Process Solutions in Automotive LIDAR Volume Manufacturing.” His presentation will highlight that the emerging technologies will result in smaller and thinner automotive Lidar packages, and their precision and quality will become the focus of all lidar suppliers and OEMs. Highly reliable automated production equipment with high speed, high precision, and high flexibility will be the essential requirements of a manufacturing solution for automotive lidar in the future.

On Wednesday September 22nd, Dr. Irving Wang, MRSI’s Director of Product Marketing, will present “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR.” He will introduce various MRSI Mycronic’s solutions for the Lidar applications. MRSI Systems (Mycronic Group) is the industry leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We are fully committed to supporting research and volume manufacturing of the emerging Automotive LiDAR devices. Contact us with your requirements today or to schedule a meeting during the conference.


For additional information, please contact: 

Jennifer Russo 
Marketing Manager, MRSI Systems (Mycronic Group) 
Tel: +1 (978) 495-9731, e-mail:
Time Zone: ET – Eastern Time 


About MRSI Systems 

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging. For more information visit 

About Mycronic  

Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm.