MRSI Systems

MRSI Systems
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MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com. MRSI Systems is part of the Mycronic Group.

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MRSI to offer die bonding demonstrations at Productronica

Tue, Oct 22, 2019 14:00 CET

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 12-15, 2019.MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD for high-volume manufacturing of advanced photonics and RF/microwave devices. The system is optimized for applications that bond large die for high-power laser diodes, industrial lasers, optical fiber amplifiers, power amplifiers,

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MRSI to offer die bonding demonstrations at Productronica

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