MRSI Systems

MRSI Systems
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MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com. MRSI Systems is part of the Mycronic Group.

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

Tue, Jul 12, 2022 18:05 CET

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022. “MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This

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MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

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