Micronic Mydata announces breakthrough sub-10µm LDI solution for global electronics packaging industry
Täby, Sweden - 9 November, 2011, Micronic Mydata AB (publ), listed on NASDAQ OMX Nordic Stockholm, Small Cap: MICR, today at the TPCA Show in Taipei, Taiwan launched a new Laser Direct Imaging (LDI) solution it says will revolutionize the production of microprocessor packages as well as smaller and thinner mobile electronic devices. Called the Micronic Mydata LDI 5s Series, the new technology is targeted at the makers of organic substrates used in the manufacturing of the complex electronic packages mounted on advanced printed circuit boards. Today's producers are reaching the limits of existing technologies' ability to maintain current production speeds while still achieving high levels of precision and alignment - at sub-10 micrometer levels.
Rethinking LDI to boost productivity
“This breakthrough solution will cause many to rethink the possibilities of direct imaging to meet the increasingly upmarket requirements of the entire mobile electronics industry,” says company President and CEO Peter Uddfors. “For us, an innovative next-generation LDI solution was a logical step: It combines our expertise in pattern-making with a strong commitment to help customers ‘get the edge’ as they are forced to align their production roadmaps to future productivity requirements.” He says the Micronic Mydata LDI 5s Series is at an advanced stage of evaluation by industry frontrunners in the US and Asia.
Substrate makers must align to the future
With a 25-year track record of serving top names in the global electronics industry, Micronic Mydata identified an unmet need when it comes to handling the dynamic, non-linear alignment requirements of organic substrates at sub-10 micrometer levels. The increased functionality requirements of higher performance microprocessors, thinner smart phones, tablets and other devices are driving the need to use tighter pitches and higher pin counts over smaller surfaces. Driven by Moore’s Law, producers must cope with shrinking lines and spaces on the substrate as well as a tightening of the layer-to-layer overlay on lower cost organic materials and resists.
Resolution and alignment – at speed
“What sets our LDI solution apart from anything in the market is that it lets producers maintain full production speed while enabling them to meet next-generation requirements for precision and alignment,” says Director, LDI Product Area, Henrik Sjöberg. He says the solution builds on the company’s expertise in pattern making and combines several unique innovations for an optimal result. These include proprietary Spatial Light Modulation (SLM) technology, high-speed data handling and precision mechanics. “Basically, we’ve found a new way to help our customers achieve high-end pattern making with excellent resolution, alignment and unmatched productivity levels,” Sjöberg concludes.
Company contact:
Peter Uddfors
President & CEO
Tel: +46 8 638 52 00
peter.uddfors@micronic-mydata.com
About Micronic Mydata AB
Micronic Mydata AB is a Swedish high-tech company engaged in the development, manufacture and marketing of a series laser based pattern generators for the production of photomasks and advanced surface mount technology (SMT) equipment for flexible production of electronics. The pattern generators are used by the world’s leading electronics companies in the manufacture of television and computer displays, semiconductor circuits and for advanced electronic packaging. The SMT equipment, including software applications, is used for surface mounting of electronic components and stencil free jetting of solder paste. The SMT equipment is used by large and small manufacturers of electronics in aerospace, aviation and telecom. Micronic Mydata headquarters is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany Japan, Singapore, South Korea, Taiwan, the Netherlands, United Kingdom and the United States. For more information see our web site at: www.micronic-mydata.com