Order backlog adjusted
Täby, Sweden – 4 October, 2013 - Micronic Mydata AB (publ), listed on NASDAQ OMX Stockholm, Small Cap: MICR, disclosed today that a previously announced order for an LDI 5s tool has been cancelled by the customer. The production tool had been expected to ship during the
first quarter of 2014.
“This order was cancelled due to factors related to the customer’s decreased need for development capacity”, commented Lena Olving, President and CEO at Micronic Mydata AB. “We have been assured by the customer that the direction of the Micronic Mydata LDI is unchanged, and there is no change to the customer’s commitment to our LDI technology. We are continuing to work together with industry leaders to refine Micronic Mydata LDI technology. The two tools in the field are invaluable in advancing the manufacturing capabilities of the LDI 5s product”.
Micronic Mydata’s production solution, the LDI 5s series laser direct imaging tool, is capable of manufacturing the most advanced chip ackaging substrates used in the production and assembly of leading edge semiconductor chips, enabling development of future electronics products.
“The implementation of higher requirements for substrates is going slower than the electronics industry previously predicted. But we are still confident of the interest in our technology from the industry, which is in need of a cost-effective production solution for manufacturing advanced substrates,” Lena Olving concluded.
Contact person:
Anna Ulinder
Investor relations
Tel: 08-638 52 00
anna.ulinder@micronic-mydata.com
About Micronic Mydata AB
Micronic Mydata AB is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment to the electronics industry. The products consist of pattern generators including mask writers and direct writers for the production of photomasks and substrates as well as advanced surface mount technology (SMT) equipment. The pattern generators are used by the world’s leading electronics companies in the manufacture of semiconductor circuits, for advanced electronic packaging and displays used in PC tablets, smart phones, TVs and computers. The SMT equipment is used for surface mounting of electronic components and stencil free jetting of solder paste. The SMT equipment is used, among others, by large and small manufacturers of electronics in aerospace, aviation and telecom. Micronic Mydata headquarters is located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany Japan, Singapore, South Korea, Taiwan, the Netherlands, United Kingdom and the United States. For more information see our web site at: www.micronic-mydata.com