News: Nexam Chemical’s product NEXIMID 500 (MEPA) in new Japanese patent
The Japanese company Nishino has received a patent from the Japanese Patent Office (JPO) where Nexam Chemical’s product NEXIMID 500 is used in a polyimide. The resin has been found to provide excellent thermal properties and solubility in combination with very good flexibility which is unique. Moreover, the resins can be crosslinked at 50-80 °C lower temperatures compared to other types of phenylethynyl based crosslinkers, which require significantly higher crosslinking temperatures. Generally, there are few other thermoset systems that can show elongation at break (a measure of flexibility)