NEXT Biometrics Provides Card Specification for Payment Network
Oslo, May 14, 2019 –NEXT Biometrics (Oslo Bors: NEXT), a global leader in fingerprint sensor technology, announces that the Company is supporting one of the top five US payment networks in mapping out biometric system-on-card (BSoC) specifications for payment smart cards. The technical documentation has been delivered to the client and NEXT will continue to support the payment network in implementing the route to market.
The collaboration draws upon NEXT Biometrics` comprehensive understanding of fingerprint sensor technology and is aimed at defining the biometric payment smart cards` system architecture. The technical specifications are based on applicable international standards and industry best practice experience that NEXT has gained through its own certification processes and projects as well as the Company`s longstanding participation in standardization committees.
“We are honored and pleased that we have been chosen to support this specification process,” said Alain Faburel, NEXT Biometrics Chief Sales and Marketing Officer. “The superiority of our large-area sensor technology has been proven by independent studies and is key for an excellent user experience. This fact and the experience from enrollment and certification processes in a variety of industry sectors have positioned us as the partner of choice for this project.”
NEXT Media contact:
Tanja Moehler, firstname.lastname@example.org
NEXT Investor contact:
Knut Stalen, email@example.com
About NEXT Biometrics
NEXT provides advanced fingerprint sensor technology that delivers uncompromised security and accuracy for the best possible user experience in the smart card, government ID, access control and notebook markets. The company’s patented NEXT Active Thermal™ principle allows the development of large, high quality fingerprint sensors in both rigid and flexible formats. NEXT Biometrics Group ASA (www.nextbiometrics.com) is headquartered in Oslo, with sales, support and development operations in Seattle, Silicon Valley, Taipei, Prague, Bengaluru and Shanghai.