Successful placement of unsecured bond issue

Fri, Mar 22, 2013 17:14 CET

Oslo, 22 March 2013

Telio Holding ASA has successfully completed an unsecured bond issue of NOK 300 million with maturity in April 2017. The settlement date for the bond issue is expected to be 10 April 2013. An application will be made for the bonds to be listed on the Oslo Stock Exchange.

The proceeds from the bond issue will be used to refinance a NOK 300 million bridge to bond loan facility with Nordea Bank Norge ASA.

Nordea Markets acted as Manager for the bond issue.