SEM cross-section of an array of cylindrical trenches of aspect ratio of 100.


SEM cross-section of an array of cylindrical trenches with a pitch of 4 μm, diameter of 2 μm and aspect ratio of 100, conformally coated with an ALD stack consisting of 40 nm of TiN, 40 nm of Al2O3, and 40 nm of TiN. Insets show a detail of the MIM stack at the top and bottom of a single trench.

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Picosun is the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for semiconductor and other industries. PICOSUN® ALD product portfolio ranges from fully automated, SEMI compliant batch and cluster systems for up to 300 mm wafer size to smaller scale R&D and pre-pilot production tools, with special emphasis on cost-efficient, turn-key production solutions for up to 200 mm wafer markets. Production-proven coating solutions for IC, MEMS, LED, sensor, and 3D component (medical devices and implants, PCBAs, machinery parts, coins, watches and jewelry) processing are mastered with world-class process quality, agile and innovative equipment design, and the most comprehensive process support and customer care. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China, and Japan, offices in France and India, and a world-wide sales and support network. For more information visit www.picosun.com.

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