Rehm features void free Vacuum Soldering Solutions for solar and semiconductor packaging applications

Rehm Thermal Systems will showcase its newest vacuum soldering technology at this month’s Semi Con West and Intersolar exhibitions in San Francisco. Members of Rehm’s technical team will be on hand at the booth of American business partner Technica USA (#5757) to explain the numerous advantages available from this enabling technology. Rehm offers void free vacuum soldering solutions for a variety of applications covering a temperature range from 50°C to 450°C which including advanced condensation reflow for lower temperatures up to their latest high temperature VS offerings. On display