Icera partners with Teleca to develop Android RIL (Radio Interface Layer) for Icera smartphone platform
Bristol, UK, and Malmö, Sweden, October 28th 2010
Icera Inc., the Mobile Broadband semiconductor company, and Teleca, a world-leading supplier of solutions and services to the mobile industry, today announced that Teleca has been selected to help develop an Android radio interface layer for Icera´s Espresso® 4xx smartphone platform family based on its Livanto® ICE806x baseband chips.
Pete Cumming, Icera´s VP Systems Engineering said, “Teleca´s extensive experience in developing Android solutions along with their proven track record for Android RIL, in particular, made them a compelling partner. The Android RIL being developed by Teleca will be a key component in Icera´s plan to launch Android solutions in 2011. We are looking forward to Teleca providing integration and customization support to our customers.”
"With a highly differentiated offering in software defined modems, Icera is emerging as a strong player in the highly competitive semiconductor market,” said Andrew Till, SVP Solutions Marketing, at Teleca. “We expect this to be the beginning of a long term relationship. Teleca has experienced very strong growth in its Android based solution sales to both the traditional mobile device market and to the consumer electronics and automotive sectors. This latest project adds a new and significant client to Teleca´s customer base and further strengthens Teleca´s leadership in developing Android RIL implementations for new platforms and products."
For more information, please contact:
Sally Doherty, Head of Corporate Communications, Icera, sally@icerasemi.com, +44 (0)1454 284859
Andrew Till, SVP Solutions Marketing, Teleca Ltd, andrew.till@teleca.com, +44 7720 428752
About Icera
Icera is a fabless semiconductor company, pioneering software-defined modem chipsets for the fast growing smartphone and Mobile Broadband device markets. Icera technology delivers the highest performance modem solutions with the smallest silicon die size for USB dongles, laptops, netbooks and smartphones. Icera technology supports 4G (LTE), 3G (HSPA) and 2G standards. Founded in 2002, Icera is headquartered in the UK, with design locations in the UK, France, USA and China, with customer engineering and sales offices in Europe, Asia and the USA. For more information, visit the Icera web site at www.icerasemi.com.
About Teleca
Teleca is a world-leading supplier of software solutions and engineering services to the mobile industry. Teleca´s global scale and reach is unique. Using tailored solutions, systems design, integration and testing we help drive down development time and deliver value. Teleca has approximately 2,000 employees in 11 countries. www.teleca.com
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