Telelogic Signs 3.3 MUSD Agreement with Global Semiconductor Manufacturer

MALMÖ, Sweden and IRVINE, California – March 17, 2008 – Telelogic (Nordic Exchange/MidCap/TLOG) today announced that a global semiconductor manufacturer has signed a three-year license and maintenance agreement for core components of Telelogic’s solutions for Enterprise Lifecycle Management (ELM), with a value of 3.3 MUSD.

The agreement sees the company standardize their enterprise change and configuration management with Telelogic Synergy™, and their processes for requirements definition, analysis and management with Telelogic DOORS®. The majority of the agreement originates from Telelogic Synergy™.

“The company’s decision to extend their current agreement coupled with standardizing on the core requirements and change and configuration management parts of our solutions for Enterprise Lifecycle Management (ELM) is yet further evidence of Telelogic as the vendor of choice for advanced systems and software development,” said Anders Lidbeck, President and CEO of Telelogic.