UT Arlington engineers working to prevent heat buildup within 3D integrated circuits
In the effort to pile more power atop silicon chips, engineers have developed the equivalent of mini-skyscrapers in three-dimensional integrated circuits and encountered a new challenge: how to manage the heat created within the tiny devices. But a team of UT Arlington researchers funded by the National Science Foundation is working first to minimize the heat generated and then to developing nano-windows that will allow the heat to dissipate before it damages the chip. Ankur Jain, assistant professor of mechanical and aerospace engineering, is working with colleague Dereje Agonafer,