Pella, EFCO introduce innovative building envelope analysis at AIA Expo

New envelope-first service helps make buildings more energy-efficient, comfortablePella EFCO Commercial Solutions will introduce their new industry-leading tool, Pella EFCO Envelope Analysis service, at the American Institute of Architects (AIA) Expo, June 26 – 28 in Chicago. AIA attendees can visit booth #1053 at McCormick Place to learn more about the service, along with innovative products and educational sessions offered by Pella and EFCO. Holistic solution to energy management Taking a holistic approach to analyzing the building envelope, Pella EFCO Commercial Solutions’ Envelope