Picosun’s ALD encapsulation prevents electronics degradation

ESPOO, Finland, 14th February 2019 – Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high reliability electronics protection with ALD. Hermetic encapsulation by ALD nanolaminates developed by Picosun has been proven to block tin whisker formation on PCB (printed circuit board) assemblies completely(*). During the observation period of over one month to three years, ALD-protected samples showed no tin whisker growth at all, whereas on non-protected samples tin whisker density of over