Picosun’s ALD technology enables 3D silicon-integrated microcapacitors with unprecedented performance
ESPOO, Finland, 2[nd] January 2020 – Picosun Group, global provider of leading AGILE ALD[®] (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore’s law, set new challenges to the power management of these devices as well. A solution is further integration of the devices’ key components into so-called SiP (