Picosun’s ALD technology helps to fight climate change
ESPOO, Finland, 30[th] January 2020 – Picosun’s Atomic Layer Deposition (ALD) thin film barrier coating technology offers a solution for eliminating the use of hazardous process gases, sulphur hexafluoride (SF\6\) and nitrogen trifluoride (NF\3\). In the current Chemical Vapor Deposition (CVD) coating methods, relatively thick films need to be grown to obtain the desired level of performance to reach the required specifications in e.g. moisture barrier, corrosion protection, passivation or insulation applications. Due to the fast film build-up on the walls of the coating equipment, the
