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Rehm CondensoX; an enabling  technology for 3D and MID

As Molded Interconnect Device (MID) technology becomes increasing popular, Rehm Thermal Systems (www.rehm-group.com) condensation soldering technology offers a precise, high efficiency alternative to the intricate processes commonly employed to create the connections between assembled components and the substrate. MID is the abbreviation for "Molded Interconnect Device." The goal of MID technology is to unite electrical and mechanical functions in a single construction unit. The circuit tracks are integrated into the housing, enabling the reduction of weight and space, and are more eco-

Rehm Thermal Systems expands its German Headquarters

As a result of continuing business growth, Rehm Thermal Systems is just finalising work on a new 5 story-building at its headquarters in Blaubeuren, Germany with new state-of-the-art facilities for both customers and employees. The new facility includes an advanced application and demonstration center, new training facilities, offices and social areas for customers and employees alike. The new building expands Rehm’s current headquarters and offers customers a 460m² high tech application and demonstration center housing state-of-the-art equipment and metrology tools for nitrogen and

Rehm support the supply demands of the VisionXC with their production facility in Dongguan, China

The VisionXC from Rehm Thermal Systems combines compact design with the best thermal performance, ensuring the best results are achieved for manufacturers across the globe. Launched earlier this year to worldwide industry acclaim the system is exclusively manufactured in Rehm’s production facility in Dongguan, China, which enables the company to meet and serve the demands of both the global and local market successfully.Rehm have been developing a presence in China for a number of years and the decision to manufacture the VXC exclusively in China is indicative of their commitment to the

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