Asetek Receives Order for New HPC Installation from Existing Global Data Center OEM Partner

Aalborg, Denmark, 21 April, 2020 – Asetek today announced the largest order to date from a current HPC OEM partner for a new, high-density cluster, located in North America, for an undisclosed and existing end customer. The installation will be implemented using Asetek’s InRackCDU™ liquid cooling solution and includes up to 24 liquid cooled racks populated by up to 1,500 compute nodes using Asetek’s Direct-to-Chip™ (D2C) heat capture technology. The order value will be between USD 600,000 - 800,000 based on final configuration, with delivery expected to be completed in Q2 2020. Annual