SCAN BIDCO A/S SUCCESSFULLY COMPLETES SUBSEQUENT ISSUE OF BONDS
Scan Bidco A/S, the parent company of Scan Global Logistics Holding ApS (“Scan Global Logistics” or the “Group”), has successfully completed a subsequent issue of bonds (the “Subsequent Issue”) under the framework of its maximum USD 250 million senior secured dual-tranche bond loan with ISIN NO0010768062 respectively NO0010768070 (the “Bonds”). Following the Subsequent Issue, the outstanding nominal amount under the Bonds will be USD 100 million and DKK 500 million, respectively. The proceeds from the Subsequent Issue will be used to support the bringing together of Scan Global Logistics