MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on July 30th, 2021 by the China National Intellectual Property Administration (CNIPA). This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing. This design significantly improves throughput when multiple tools are needed in fabricating complex multi-die devices by practically eliminating time consuming