Asetek to Showcase Liquid Cooling Technology for AI and HPC at SC18
San Jose, Calif. – November 6, 2018, 5:00 a.m. PT – Asetek, the leader in flexible, reliable and proven liquid cooling for high performance computing (HPC) and artificial intelligence (AI), announced it will showcase its latest heat rejection technologies in booth #2233 at Supercomputing 2018 (SC18). Also on display will be Intel® Compute Modules that include Asetek direct-to-chip (D2C) liquid cooling technology, validated and factory installed by Intel. Density and interconnect optimization is key to obtaining the computational power needed for HPC and the quickly evolving AI, machine