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MRSI launches new die bonders with improved accuracy

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems is proud to announce the introduction of the MRSI-HVM1 and MRSI-H1 die bonders with 1µm machine accuracy.The new products, MRSI-H1 and MRSI-HVM1, have been developed from our popular MRSI-H/MRSI-HVM platforms, further improving accuracy to 1 micron level and providing ideal solutions for the increasingly demanding applications such as mass manufacturing of silicon photonics and LIDAR. The MRSI-H1 and MRSI-HVM1 will be available in the Q4,

MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo

We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th China International Optoelectronic Exposition (CIOE) and will present at the CIOE Conference.This event will be held from September 7-9th (postponed to December 7-9th) at the Shenzhen World Exhibition and Convention center. We will be showcasing our family of die bonders and our latest product releases targeting our fast-growing markets of aerospace & defense, medical, datacom and emerging technologies including high performance laser diodes and LiDAR. Using case studies across our many markets we will be

MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum ", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR industry. This collaboration promises to generate innovative LiDAR solutions for the industry.LiDAR (light detection and ranging) technology is becoming the standard equipment in medium-end and high-end vehicles. In the next five years, the demand for automotive LiDAR in advanced driver assistance systems (ADAS) applications will grow at a compound annual growth rate (CAGR)

MRSI launches new Die Bonder with improved throughput for high power laser manufacturers

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful MRSI-H-HPLD, tailored for high power laser die attachment applications, significantly improves the throughput by using parallel processing while maintaining high accuracy and flexibility. MRSI-H-HPLD+ will be available in the 3rd quarter of 2022. “MRSI’s die bonders have been widely used over many years by high power laser manufacturers. This new HPLD+ version takes the performance to the next level. This

MRSI to offer die bonding demonstrations at Productronica

MRSI Systems (Mycronic Group) will be exhibiting at Productronica. Product demos will be offered at the Mycronic Booth #342 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 16-19th, 2021. MRSI will demonstrate the industry-leading 1.5 micron die bonder, MRSI-H-HPLD  which will highlight · tailored design for bonding large high-power laser diodes in mass production · capability of die bonding single emitter, bar laser in different packages, like CoS, C-mount, Bar-on-Submount(BoS), etc. ·

MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23[rd], 2021, a leading event in the industry exclusively focused on automotive LIDAR technologies and applications. On Thursday September 23[rd ], Dr. Limin Zhou, MRSI’s Senior Director of Strategic Marketing, will present “Die Bonding Process Solutions in Automotive LIDAR Volume Manufacturing.” His presentation will highlight that the emerging technologies will result in smaller and thinner automotive Lidar packages, and their precision and

MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135) on July 30th, 2021 by the China National Intellectual Property Administration (CNIPA). This patent covers an innovative design that utilizes a precision horizontal tool holding turret for rapid and in-process calibration-free tool changing. This design significantly improves throughput when multiple tools are needed in fabricating complex multi-die devices by practically eliminating time consuming

MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos

MRSI Systems (Mycronic Group) will exhibit at the 23[rd] China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI will be conducting live product demos of the MRSI-HVM die bonder with conveyor at MRSI’s booth #4B79. MRSI will also present at the Infostone Optical Communication Market and Technology Conference (IFOC). The MRSI-HVM with a conveyor is designed specifically for tray-based applications such as die attach, passive UV lens attach, and in-situ UV curing. It is proven for its’ speed, zero-

MRSI to Offer Live Die Bonding Demos at Laser World of Photonics , March 17-19, 2021

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New Interational Expo Center (Booth #W2.2587) in Shanghai, China March 17-19, 2021.  A representation of the MRSI Mycronic booth (Booth #W2.2587) MRSI is offering demonstrations of the MRSI-H-LD Die Bonder onsite LIVE in our booth, (Booth #W2.2587). Our Chinese application engineers will be on-site to discuss your process engineering needs and how our die bonders provide assembly solutions for your specific applications. To schedule a live demonstration in

MRSI-S-HVM Submicron Die Bonder won the award for "Infostone 2020 The Most Competitive Optical Communications Product"

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized by a panel of industry experts. On January 21, Infostone 2020 annual meeting and the 7th award live conference of heroes list were successfully held and Infostone announced the list of winners of the 7th heroes list. There were three categories of awards: "The Most Competitive Optical Communications Product," "Excellent Quality Award" and "Brand Recommendation Award." MRSI’s submicron

MRSI launches MRSI-705 high-volume configuration

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position in the die bonding industry offering customers multiple application solutions in one machine. This new configuration offers an innovative horizontal turret feature to significantly increase the speed and throughput from the machine without sacrificing its renowned flexibility, accuracy, or reliability.The new MRSI proprietary design delivers an “on-the-fly” tool change with up to 12 tools with zero

MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging electronic and photonic chips, and wafer-level packaging.This advanced die bonder is based upon MRSI’s field proven high-speed HVM die bonder platform for high-volume manufacturing of integrated photonics that requires ultimate accuracy at the submicron level. It has inherited the speed using multiple levels of parallel processing from the HVM platform. It also has the HVM’s high level of flexibility for multiple die applications using auto-

MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19[th] Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September 7-8, 2020. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems, will be presenting “Innovative Assembly Solutions: Volume Manufacturing of Novel Devices in the 5G Era.” MRSI Systems will exhibit at the 22[nd] China International Optoelectronic Exposition (CIOE). Live product demos will be offered at MRSI’s booth #8E55. The show will be held at the Shenzhen World Exhibition &

MRSI Files Patent Infringement Lawsuit Against Palomar Technologies

Company asserts rival infringes four separate patents in connection with its high-precision manufacturing products.Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement lawsuit against Palomar Technologies, Inc. in the United States District Court for the Southern District of California. The suit alleges that Palomar’s die, wire, and wedge bonder products infringe MRSI’s U.S. Patent No. 7,324,710, titled “Method and Device for Determining Nominal

MRSI receives Laser Focus World Innovators Award for HVM die bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for the Laser Focus World  Innovators Award in the Manufacturing Equipment for Photonic Components category.The MRSI-HVM  was recognized for a very good innovation that resulted in marked improvement over previous methods employed, approaches

MRSI to offer die bonding demonstrations at Productronica

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 12-15, 2019.MRSI will demonstrate the industry-leading 1.5 micrometer die bonder, MRSI-H-LD  for high-volume manufacturing of advanced photonics and RF/microwave devices. The system is optimized for applications that bond large die for high-power laser diodes, industrial lasers, optical fiber amplifiers, power amplifiers,

MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is based in Shanghai. His substantial technical experience selling semiconductor equipment along with his vast network in the Chinese market is guaranteed to even further enhance our responsiveness to our customer’s needs.MRSI is expanding globally in the die bonding market with the support of our Swedish parent company, Mycronic. Hendry is joining the team at a busy and exciting time for MRSI, as our

MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show will be held at the Shenzhen Convention and Exhibition Center from September 4-7, 2019.MRSI Systems will also attend the 18th ICCSZ OC Market and Technology Seminar. This event is organized by Infostone Communication Consultant (ICCSZ) in Shenzhen, China, from September 2-3, 2019. Dr. Yi Qian, Vice President of Marketing, MRSI Systems, will be presenting “Progress in Assembly Automations:

MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders

MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference samples. Results showed enhancement from ±3 micrometers at 3 sigma, to ±1.5 micrometers at 3 sigma. Moving forward for shipment starting from October 1, 2019, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3).MRSI’s trademark of high-speed and high flexibility remains uncompromised with the improved accuracy. Our customers now have options to design products for

MRSI announces HVM3 die bonding demonstration capability in Shenzhen China

MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement.   This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class local application engineers for a quick turn-

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