Sivers Semiconductors Wins a Major Chip Development Program with Leading Tier-1 Telecom Infrastructure Vendor
The $5.4M program will support the development of a next-generation highly-integrated beamforming transceiver for a variety of mmWave telecom applicationsKista // Sweden // January 8[th], 2025 // Today, Sivers Semiconductors announced that it has been awarded a major chip development program by a leading Tier-1 telecom infrastructure vendor. The $5.4M program will run from Q1 2025 to Q4 2026, and will support the development of a next-generation highly-integrated beamforming transceiver for various millimeter-wave telecom applications. Sivers’ RF-SOI-based SUMMIT beamformer product