Diamorph publishes bond prospectus and applies for listing of its bond loan on Nasdaq Stockholm
On 27 August 2014, Diamorph AB (publ) announced that the company had decided to issue a secured SEK 500 million bond loan within a total framework amount of SEK 800 million on the Swedish bond market. The tenure of the bond is 5 years and it has an annual coupon of 7.00 percent. The company has applied for listing of the bonds on Nasdaq Stockholm and the first day of trading is expected to be on October 6 2014. In relation to the listing, the company has prepared a prospectus which has been approved by the Swedish Financial Supervisory Authority. The prospectus is available on the