MRSI announces HVM3 die bonding demonstration capability in Shenzhen China
MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district, Shenzhen, China. MRSI will be offering local demonstrations of its market leading MRSI-HVM3 die bonder and also die bonding applications using customer’s sample materials, by arrangement. This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class local application engineers for a quick turn-