MRSI to offer die bonding demonstrations at Productronica
MRSI Systems (Mycronic Group) will be exhibiting at Productronica. Product demos will be offered at the Mycronic Booth #342 in Hall A3 (SMT Cluster). The exhibition will be held at Messe München in Munich, Germany from November 16-19th, 2021. MRSI will demonstrate the industry-leading 1.5 micron die bonder, MRSI-H-HPLD which will highlight · tailored design for bonding large high-power laser diodes in mass production · capability of die bonding single emitter, bar laser in different packages, like CoS, C-mount, Bar-on-Submount(BoS), etc. ·