New HPC Installation to Deploy Asetek Liquid Cooling Solution
Asetek today announced confirmation of an order from one of its existing OEM partners for its RackCDU D2C™ (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC (High Performance Computing) customer. “I am very pleased with the progress we are making in our emerging data center business segment. This repeat order, from one of our OEM partners, to a new end customer confirms the trust in our unique liquid cooling solutions and that adoption is growing,” said André Sloth Eriksen, CEO and founder of Asetek. The order will result in