Mycronic to demonstrate comprehensive line automation, dispensing and inspection solutions at SMT Hybrid Packaging 2018
Täby, 30 May, 2018 – Mycronic AB (publ) will showcase its growing range of next-generation jet printing, inspection, pick-and-place, dispensing and storage solutions for automated just-in-time electronics assembly at SMT Hybrid Packaging 2018 in Nuremberg (Booth 4-349, June 5-7). Inspection solutions became part of the product portfolio with the acquisition of Vi TECHNOLOGY, a leading provider of 3D automated optical inspection and solder paste inspection solutions. By combining 3D inspection with its latest pick-and-place and jet dispensing platforms, Mycronic can now offer the most